It’s clear that communities now have an effective playbook to block data center construction. This week, researchers flagged ...

European cloud funding in 2025 was led by a handful of large growth-stage rounds, alongside continued investment in ...

A research team at POSTECH led by Professor Wook-Shin Han of the Department of Computer Science and Engineering and the ...

Researchers designed a twisted 2D conductive MOF that preserves its electronic properties when stacked, advancing practical ...

Are two sets of data genuinely different, or is it because of randomness? This question, known as the two-sample testing problem, becomes notoriously difficult in modern datasets, because they are ...

Researchers may have unlocked the future of computing by turning flat silicon chips into densely stacked 3D architectures.

AI is not just changing the bottom of the org chart; it’s also reshaping the top. Senior leadership, executive, C-suite, and ...

KAIST researchers develop a next-generation 2D conductive material that maintains single-layer electronic properties even ...

ARM Mali open source GPU driver gains its first Rust-written shader compiler: KRAID, merged into Mesa 26.2 on June 3, 2026 by ...

SK hynix HBM cooling takes a new form: the South Korean chipmaker embeds silicon-based elements directly inside the HBM package, cutting thermal resistance by more than 30 percent. The iHBM architectu ...

Leadership at the Pentagon reiterated the agency’s commitment to diversifying its artificial intelligence service providers, with Under Secretary of Defense for Research and Engineering Emil Michael ...

A memory device that can operate at temperatures over 700 °C could enable electronic systems to withstand harsh conditions with less need for cooling. The device, which is a memristor based on ...