TSMC is preparing to mass-produce panel-level packaging (PLP), a next-generation chip-packaging technology — setting up a ...

TSMC's upcoming CoPoS packaging technology could reduce chip costs while improving AI performance, with mass production reportedly targeted for 2028.

PAC Machinery’s “Flexible Sustainability” bagging systems — including the Rollbag R3200XL Fulfillment Paper model featured at Automate 2026 — allow fulfillment operations to adapt to evolving ...

The stealthy black resin case pays homage to extreme-performance summer tires with custom graphics and bespoke packaging.

The 2026 IEEE Electronic Components and Technology Conference (ECTC) showcased how advanced packaging can redefine the scalability limits of artificial intelligence (AI) and high-performance computing ...

Scientists from Nanyang Technological University, Singapore (NTU Singapore) have developed a new method to recycle mixed ...

One joked that the driver had the easiest day of his life, delivering an entire truckload of near-weightless boxes to one address.

British-Albanian pop star Dua Lipa has filed a $15 million (€13.2 million) lawsuit against Samsung, alleging the tech giant used her image on television packaging without permission. According to a ...

Abstract: To address the challenge of large-scale packing problems, this paper proposes a novel hierarchical algorithm based on the geometrical classification of parts. The algorithm begins by ...

Abstract: A methodology of designing the packaging box based on the topology optimization technique is proposed. The packaging box is designed not only to protect the fragile liquid crystal display ...

Melania Trump's upcoming documentary movie may be a total bust at the box office. According to a new report, there have been barely any tickets purchased in pre-sales for MELANIA, which hits theaters ...