Abstract: Increasing demand for DRAM scaling and high-bandwidth has driven DRAM technology to 3D/2.5D integration. With the innovative Hybrid Bonding technology, a new Stacked Embedded DRAM (SEDRAM) ...
Abstract: Conventional beamforming with fixed-position antenna (FPA) arrays has a fundamental trade-off between maximizing the signal power (array gain) over a desired direction and simultaneously ...
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