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When we talk about the cost of AI infrastructure, the focus is usually on Nvidia and GPUs -- but memory is an increasingly ...
JEDEC’s HBM4 and the emerging SPHBM4 standard boost bandwidth and expand packaging options, helping AI and HPC systems push past the memory and I/O walls.
If you want to be in the DRAM and flash memory markets, you had better enjoy rollercoasters. Because the boom-bust cycles in ...
Per-stack total memory bandwidth has increased by 2.7-times versus HBM3E, reaching up to 3.3 Tb/s. With 12-layer stacking, Samsung is offering HBM4 in capacities from 24 gigabytes (GB) to 36 GB, and ...