For design teams adopting 3D-IC architectures, the relentless pursuit of performance and reliability brings a familiar, yet ...

In the age of Industry 4.0, manufacturers are expected to develop increasingly sophisticated, digitally integrated products while controlling development costs and accelerating time to market.

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Abstract: This article introduces a novel multiphysics modeling framework for the high-fidelity simulation of superconductors in microwave. The proposed approach integrates the time-dependent Ginzburg ...

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COMSOL shares the locations of its worldwide COMSOL Conference 2026 tour, which will kick off in Cambridge, the UK, on September 23–25. The event will also make stops in Boston, MA, on October 7–9; ...

Abstract: As the integrated chip packaging technology progresses from 2.5-D to 3-D, new issues arise regarding the reliability of interconnects. The analysis of interconnect reliability is inherently ...

Credit: Gorodenkoff/Shutterstock Enhances system-level engineering with expanded digital twin capabilities and connected modeling workflows that deliver deeper real ...