GRENOBLE, France--(BUSINESS WIRE)--Hprobe, a provider of turnkey semiconductor Automatic Test Equipment (ATE) for magnetic devices, today announced a breakthrough magnetic test head revolutionizing ...
The move to multi-die packaging is driving chipmakers to develop more cost-effective ways to ensure only known-good die are integrated into packages, because the price of failure is significantly ...
In the fast-paced world of semiconductor manufacturing, achieving higher yields and reducing costs are constant challenges. Ideally, yield should only be impacted by unavoidable defects when ...
The back-end semiconductor manufacturing process refers to the IC packaging and testing that people often hear about. Specifically, the process known as chip probing (CP) is conducted to test the ...
FREMONT, Calif., May 19, 2011 (GLOBE NEWSWIRE) -- Aehr Test Systems (Nasdaq:AEHR), a worldwide supplier of semiconductor test and burn-in equipment, announced today that it has received over $2 ...
Increasingly in industry and recently in semiconductor manufacturing, partly due to the introduction of sensor-based data collection, network connectivity, and the availability of cheap data storage ...
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