Ajinomoto build-up film (ABF) substrate has been a key component in chip manufacturing since its introduction shortly before the turn of the millennium. Substrates made with Ajinomoto build-up film – ...
QINGPU, SHANGHAI, CHINA, February 12, 2026 /EINPresswire.com/ — Introduction: The Evolving Landscape of China’s BOPP Industry China’s BOPP (Biaxially Oriented Polypropylene) film manufacturing sector ...
QINGPU, SHANGHAI, CHINA, February 12, 2026 /EINPresswire.com/ -- Introduction: The Foundation of Packaging Performance ...
New portfolio drives chip performance with panel-based interconnect innovation KLA is extending the capability of the proven Corus™ direct imaging platform and introducing the Serena™ direct imaging ...
Electronic waste and its associated pollution are becoming increasingly threatening on a global scale. With the continued development of various new application areas including robots, wearable ...
The rise of artificial intelligence (AI) and the new energy / autonomous vehicle industry presents both challenges and exciting opportunities for the printed circuit board (PCB) and packaging ...
How equipment R&D drives OLED and semiconductor innovation behind modern electronics.
STMicroelectronics and Soitec have announced the next stage of their cooperation on silicon carbide (SiC) substrates, with the qualification of Soitec's SiC substrate technology by ST planned over the ...
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