CARLSBAD, Calif.--(BUSINESS WIRE)-- Nordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, has developed several solutions for panel-level packaging (PLP) ...

Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711) and a ...

Applied Materials has agreed to acquire the NEXX business from ASMPT Limited, expanding its advanced packaging tools for AI chipmaking. The deal adds panel level advanced packaging capabilities to ...

In a new report from Business Korea, we're hearing that Samsung is making "significant strides" in the semiconductor packaging industry, "positioning itself ahead of TSMC in the Panel Level Packaging ...

On the 20th, local time, at the research building of Lam Research, a semiconductor company in Salzburg, Austria. Here, the ...

Nvidia Corp (NASDAQ:NVDA) plans to use Fan-Out Panel Level Packaging (FOPLP) technology for its GB200 AI server chips earlier than scheduled to address the production constraints of Chip on Wafer on ...

SCHMID Group (NASDAQ: SHMD), a global leader in advanced manufacturing solutions for the electronics and semiconductor industries, is advancing next-generation substrate manufacturing with its ...

Innolux Corporation, a leading display panel manufacturer, is undergoing a significant transformation as it ventures into the semiconductor field with its Fan-Out Panel Level Packaging (FOPLP) ...

Innolux Corporation is pushing forward with fan-out panel-level packaging (FOPLP) technology, aiming for mass production in first-half 2025 despite previous delays. As the first quarter ends, Chairman ...

Semiconductor equipment corporations Applied Materials said on the 7th that it signed a definitive agreement with ASMPT to ...

The ASYMTEK Vantage® Dispensing system equipped with IntelliJet® Jetting system reduced underfill voids and decreased cycle time by almost 30%. Nordson’s industry-leading ASYMTEK Vantage® Series fluid ...